Multilayer perceptron jobs
...mine I need a small batch of prototype boards. Board will include: MM6108 - wifi802.11ah chip at 850-950mhz, SPI/SDIO controlled. STM32U5 - for controlling MM6108 via 50mhz SPI or SDIO Any 10/100mbps SPI ethernet controller with ethernet to stm32 One or two stage PA from MM6108 to antenna Probably some of these chips/transistors TQP7M9106 CGH40006P CGH40010F Or something else. Multilayer design with correct RF tracing and impedance matching. + Heat dissipation. Total output power is targeted to 33-35dbm by utilising 40dbm output PA under its compression to ceep PAPR and EVM in check. Smal footprint, preferably 40*40mm or similar. Mounts for heatsink. Inputs - power 12-48v or 24-48v Ethernet 10/100mbps rg45 or vibration resistant JST connector which will be used with just
...outputs that feed the plant’s PLC. A small TFT or OLED status screen and a Modbus-RTU port over RS-485 will round out the human-machine and network interfaces. I will provide the exact sensor datasheet, operating ranges, and the enclosure footprint; you handle everything from component selection to fully-routed Gerber files and production-ready firmware. Key deliverables • Schematic capture and multilayer PCB layout (KiCad or Altium) matching my mechanical constraints • BOM with second-source options for all active parts • Firmware (C/C++ on STM32 or equivalent) that: – Reads the oxygen sensor via the recommended analogue front end – Filters and linearises the signal in real time – Publishes the value over Mod...
I need a compact, production-ready circuit board that acts as the main control system for a self-service car-wash vending unit. Its first responsibility is to handle payment processing—accepting coins, bills, and potentially a simple cashless module—then trigger the wash cycle once payment is validated. You will translate this into a complete hardware package: schematic, multilayer PCB layout, and a cleanly organised BOM with readily available components. I will provide the pin-out for the existing coin validator and the relay map for the wash equipment; you make sure the board routes power safely, isolates high-current lines, and exposes clean connectors for future add-ons such as water-flow control and a small customer display. Because the installation sits in a ...
You will receive the existing schematics, BOM, and mechanical constraints after we sign an NDA. I am flexible on the choice of microcontroller or processor as long as it offers enough I/O and headroom for future firmware updates; I’m happy to discuss ARM Cortex, AVR, PIC, or any alternative you feel best suits the job. Key deliverables: • Updated consolidated schematic • Optimised multilayer board layout with clear differential pair routing where needed
Project Brief: B2B Lead Generation for Indian Flexible Packaging Sector Project Overview: This project focuses on mining targeted B2B contact data within the flexible packaging manufa...Packaging Manufacturing sector. Required Data Fields: 1. Company Info: - Account Name - Website URL - Physical Address (City included) 2. Contact Info: - Contact Person’s Name - Job Title - Verified Corporate Email Address - Mobile Number 3. Professional Link: - LinkedIn Profile (if available) Target Audience & Geography: Industry: Flexible Packaging Manufacturing (e.g., multilayer films, pouches, laminates, wrappers). Geography: India (focusing on Gujarat, Tamil Nadu, Karnataka, Maharashtra, Andhra Pradesh, Kerala). Company Size: Small, Medium, and Large enterpr...
I’m setting up a new mobile-phone venture and I want a seasoned PCB designer to join me at the ground floor. I will fund the hardware development; what I need from you is the end-to-end PCB engineering that turns our handset concept into a manufacturable reality. Scope of work • Architect and lay out a multilayer board that fits a slim smartphone form factor. • Integrate the core silicon (application processor, memory, RF front-end), battery interface and power-management circuitry, plus all critical sensor breakouts. • Optimise signal integrity, thermal behaviour and EMI/EMC so the design can clear FCC/CE without major rework. • Produce complete deliverables—schematics, layered Gerber/ODB++ files, annotated BOM, pick-and-place data and a bri...
I need an experienced KiCad PCB designer for an ESP32-S3 based audio/IoT prototype board with battery The board will include: - ESP32-S3-WROOM-2 module - PN532 NFC/RFID support - microSD storage - High-quality I2S Class-D audio amplifier for 4Ω 3W–5W speaker - USB-C 5V input - Rechargeable Li-ion/LiPo battery support - Battery charging circuit - Battery protection - Power-path/load-sharing management - 3.3V regulation for ESP32 and peripherals - Proper power supply/filtering for the audio amplifier - 2 rotary encoders/buttons for volume/navigation - Small SPI color display, approximately 1.7–2.0 inch, ST7789 or similar - Display backlight contrrol. - Status LEDs - Test points for debugging and production testing
I’m developing a compact 1 × 1 inch board dedicated to sensor integration and need an experienced electronic designer to turn my concept into production-ready files. The job involves creating the full schematic, laying out the multilayer PCB, and preparing all manufacturing outputs while keeping signal integrity and power routing clean within the tight footprint. Because this board’s sole purpose is to host sensors, component placement and trace routing must anticipate minimal noise coupling and allow straightforward connector access on at least one edge. You are free to choose the CAD package you’re most efficient with—KiCad, Altium Designer, Eagle, or similar—as long as the final deliverables meet standard fabrication requirements. Deliverable...
...Altium Designer, followed by a working, well-documented firmware build. What I already know: the board must host the STM32 MCU, a cluster of sensors and actuators, an onboard wireless communication module for short-range data exchange, and a solid power-management stage so the whole unit can run reliably from a single DC source. What I need from you: • Complete Altium schematic capture and multilayer PCB layout • Gerbers, fabrication drawings, and a clean BOM with part numbers still in stock • Firmware written in C (HAL or LL is fine) that brings up the peripherals, handles sensor I/O, drives the actuators, and exposes a simple wireless protocol for configuration and telemetry • Brief bring-up guide so I can reproduce your test results on the first ...
...experienced hardware engineer to design a custom, battery-powered AI camera mainboard. The board is built around the STM32N657 (Cortex-M55 + Neural-ART NPU) and integrates a MIPI CSI-2 day/night camera, Wi-Fi 6 / BLE, a 1S2P 9600 mAh Li-ion power subsystem (switching charger + fuel gauge), IR + white illumination drivers, audio, microSD and USB-C. This engagement is hardware only: schematic capture, multilayer PCB layout (likely 6–8 layers, Altium), full manufacturing files with native sources, and 3–5 assembled, tested samples. Firmware is handled in-house. Two skills are non-negotiable: STM32N6/H7 designs with external boot flash, and routing MIPI CSI-2 camera interfaces with controlled impedance. We have a validated reference design on the same SoC to share as a f...
...that you locate and tag suspect machines, take them with you, and bring them back once they pass your bench test. When you return a miner, I expect it to hash at full spec for at least 24 hours with no ASIC errors and the latest stable firmware loaded. Please reply only if you are already based within driving distance of Sugar Land or Rosenberg and have the equipment to troubleshoot and rework multilayer boards—hot-air rework station, micro-soldering tools, oscilloscope or logic analyzer for signal tracing—plus experience with Antminer-class hardware....
I need a power-electronics specialist to take my high-frequency resonant converter from concept to production-ready multilayer PCB. The heart of the job is the board layout in Altium Designer, but success hinges on excellent EMI/EMC behaviour, solid thermal management and reliable high-current paths. Here’s what I have so far: complete schematics, key component selections and preliminary LTspice simulations. What I’m missing—and what I’m hiring you for—is a clean, fabrication-ready Altium project that respects controlled-impedance routes, minimizes switching noise and keeps temperature rise well within spec. If you have past wins in wireless power transfer or EV chargers, that insight will fit perfectly with the power levels and frequencies we’...
...expansion into additional connected vehicle accessories. Please include examples of similar embedded or automotive PCB projects, your preferred CAD software, estimated timeline, and a brief description of your approach to creating the smallest practical production-ready design. Preference will be given to designers with experience in automotive electronics, BLE-enabled embedded systems, and compact multilayer PCB layouts....
...from PCB and firmware to cloud, AI, and mobile Core Expertise Covers the Entire IoT Chain-> Embedded Firmware DevelopmentSTM32, ESP32, Arduino, nRF, PIC, Raspberry PiBare-metal & RTOS (FreeRTOS)BLE, Wi-Fi, LoRa, MQTT, CAN, SPI, I²C, UARTSensor integration, power optimization, OTA updates-> PCB Design & Hardware EngineeringSchematic + PCB design (EasyEDA, Altium, KiCad)Single-layer to multilayer boardsBOM optimization & DFM/DFA supportPrototype-ready Gerbers & manufacturing files-> Cloud, Backend & AI IntegrationAWS, Firebase, custom backend APIsIoT dashboards & device managementData processing, analytics, AI/ML integrationSecure communication & scalable architecture-> Mobile ApplicationsiOS (Swift) & Android (Kotlin)Cross-platform...
I have completed the schematic and multilayer PCB layout for a custom GNSS / GPS module that will sit inside a small-form-factor UAV. Before I press the “order” button, I need a second set of expert eyes to validate every critical detail, with extra attention on the power-supply architecture—which I flagged as my primary concern. The review should cover GNSS/RF trace routing, impedance control, grounding strategy, EMI/EMC risk points, component placement for manufacturability, and overall reliability under airborne vibration and temperature swings. If you spot an issue, I expect you to offer (and, if we agree, implement) concrete fixes so the board comes back right the first time. Design files are proprietary; I will share the Altium project after I see examp...
...my team now handles manually. Its core purpose is task automation, and more precisely workflow automation, so every design and coding decision should support that end. The agent must be able to: • Document routing – read incoming files or messages, understand context, and pass each item to the correct person, folder, or third-party system. • Approval processes – trigger, monitor, and record multilayer approvals, nudging stakeholders when they lag, and logging a full audit trail. • Scheduling tasks – analyse workload and availability, then automatically book or reschedule tasks, meetings, or follow-ups on the calendar. I expect you to choose or fine-tune the most suitable LLM, wrap it in a lightweight agent framework (LangChain, LlamaIndex, o...
...fabrication/assembly drawing Acceptance criteria 1. All high-speed pairs within ±50 mil of the reference length, impedance within the stack-up tolerance. 2. No DRC, ERC or manufacturer blockers at the chosen 6-layer stack-up. 3. Files open error-free in the latest KiCAD stable release and pass an external Gerber viewer check. If you have a proven track record with similar high-density, multilayer industrial boards, I’d be happy to review your portfolio and move forward....
I’m developing a medical-grade device and need a robust multi-layer PCB that integrates a microcontroller at its core. The board must respect the tighter clearances, high-reliability traces, and documentation standards typical of IEC 60601 workflows, yet remain manufacturable with mainstream fabrication houses. Here’s what I expect: • Complete schematics and stack-up showing controlled-impedance layers • Component placement optimized for the chosen microcontroller, low-noise analogue front-end, and test points • Clean, DFM-checked Gerber/ODB++ outputs, drill files, and pick-and-place data • A concise BOM with manufacturer part numbers and at least one alternative per key component • Basic power-integrity simulation results confirming stable ra...
...minutes. • A small, front-panel LCD that shows live voltage, current, present polarity, and any status or fault messages. • A USB port that exposes the raw data stream so an external PPM meter (and future logging software) can read concentration values. Deliverables I expect: 1. Complete, simulation-tested schematic in Altium, KiCad, or a comparable professional package. 2. Optimised multilayer PCB layout with clearances suited for 60 V/10 A, including silkscreen labelling and test points. 3. Full manufacturing pack—Gerbers, drill files, pick-and-place, BOM with part numbers in active distribution, and an assembly drawing. 4. Firmware source and compiled binary for the control MCU covering LCD menu, USB output, polarity timing, constant-current/volt...
...or 4 as you judge discipline are critical. The Ethernet interface must sustain full-duplex gigabit speeds; no other user I/O (USB, HDMI, SD) is required. If you can hit the same feature set with a cheaper or faster-to-source tuner, demodulator, or SoC, let me know—cost and lead-time are important factors. Deliverables I expect: • Schematic capture and complete annotated BOM • Compact multilayer PCB layout ready for PCBA (Gerber, drill, pick-and-place, assembly drawings) • Signal-integrity checks around the Ethernet PHY/RGMII and memory buses • Power tree, thermal estimates, and basic DFM notes I will validate the design by ordering the first spin exactly from the files you supply, so please ensure footprints, stack-up, and reference design...
1. Main Controller • The board’s main controller will be a microcontroller from the Teensy 4.0 class. It must have sufficient processing speed and GPIO capacity. 2. Integrated ESC • The board will feature a built-in ESC for driving a brushless starter motor. • It must support a current capacity of ≥40A. • The ESC will be powered by a 3S-4S battery. (Minimum 11.1–14.4 V, Maximum 12.6–16.8 V) • The necessary protection and secure signal connections must be provided between the motor driver and the controller. 3. Glow Plug Output • The board will include a power switching output for the glow plug. • It must support a current capacity of ≥16A. • On/Off control is sufficient. • The glow plug will be powered by 3S or 4S volt...
...output under varying load and temperature. -High efficiency and low EMI because this board will sit close to sensitive vehicle controls. -Robust protection—input reverse polarity, over-current, over-temperature and soft-start are all essential. Preferred workflow You run the calculations, build and verify the topology in LTspice, PLECS, or a similar simulator, then create the schematic and multilayer PCB in Altium (KiCad is fine if you prefer). I’ll review each milestone before we move on to the next. Deliverables 1. Design report with key equations and component choices 2. Simulation files showing efficiency and transient behaviour 3. Complete schematic and annotated PCB layout (Gerbers + 3D step) 4. BOM with manufacturer part numbers and availability...
I need an experienced PCB designer to replicate a multilayer consumer electronics board based on existing schematics. The board is used in a radio device and involves complex signal processing. Key Requirements: - Accurate replication of the existing PCB. - Maintain all signal processing functions. - Ability to work with obsolete designs. Ideal Skills: - Expertise in multilayer PCB design. - Strong background in signal processing circuits. - Experience with outdated technology and schematics. Please provide samples of similar work and estimated timelines.
I have several reference designs in JPEG format that need to be rebuilt as layered, print-ready files for a back-lit shadow box (paper-cut lightbox). The finished artwork must loo...finished, I’ll need: • Editable .AI file with clearly named layers • High-res PNG preview for quick client sign-off • Print-ready PDF (same dimensions, bleeds embedded if needed) Because this project is time-sensitive, I’m looking for a quick turnaround—ideally you can start right away and deliver the first draft within days. Please include examples of past shadow box, lightbox, or other multilayer paper-cut projects you’ve handled so I can gauge fit immediately. If you’re confident with realistic paper-cut illustration and precise vector prep for lase...
...design: Firewall configuration Access control (role-based) Encryption Server infrastructure: PRS (Public Repository Server) SPS (Secure Publishing Server) File server / cloud (SharePoint / Google Workspace) Maintenance plan Test plan (with expected results) User feedback + optimization analysis PART 3: Cisco Packet Tracer (.pkt file) You must build a fully working simulation, including: Core multilayer switches VLANs for each department Routing (inter-VLAN) DHCP / DNS (if applicable) VPN or simulated remote access Servers configured Security (ACLs / firewall logic) Proper port mapping Fully tested connectivity PART 4: Technical Report Implementation proof (screenshots, configs) Test execution results Network performance analysis Recommendations for improvements PART 5: Evalu...
Please follow the specifications and structure below carefully: 1. Poster Size & Layout Dimensions: 85 cm (width) × 120 cm (height) Orientation: Portrait (Vertical) Resolution: Minimum 300 dpi Color mode: CMYK Format: Final file in PDF (preferred) or TIFF No bleed required 2. Title Section Title:Adipose Cellular Memory and Post-Diet Weight Regain: A Multilayer Mechanistic Review Font size: 85–100 pt Font style: Bold, clear, professional (e.g., Arial, Helvetica, or Calibri) 3. Author & Affiliation Author name: (will send after submission the work) Supervisor: Font size: 40–50 pt 4. Logos Include official logos of: King Abdulaziz University University of Ha’il Place logos at the top corners (left and right), maintaining high resolut...
I need a Microsoft Access database built from the ground up to manage multilayer Bills of Materials exported from SolidWorks. The single most critical feature is a master parts table that enforces truly unique part IDs—no duplicates can slip through. Around that core, I also want: • A BOM table that captures all parent-child relationships between assemblies and parts. • An operation table covering every manufacturing step (laser, punch, fold, weld, etc.). • A routing table that ties each part to its sequence of operations. • A revision table so every change is tracked and auditable. The relationships among these tables must be fully defined and referential integrity enforced. On the user side I’m looking for: • A clean part-entry f...
Required Experience: Electrostatic Chuck (ESC) Design & Development Ceramic ESC design and material selection (Al₂O₃, AlN, TiO₂-doped, etc.) Electrostatic clamping mechanism design: Johnsen-Rahbek type, Coulomb type, hybrid type, etc. Electrode pattern design and multilayer ceramic lamination technology High-purity, high-density ceramic sintering and machining technology Optimization of plasma resistance, thermal conductivity, and insulation properties Semiconductor Equipment Related Technology Process equipment design and development for CVD, PVD, etching, ion implantation, annealing, etc. Hands-on experience in vacuum technology, plasma control, temperature control, gas flow control, etc. Wafer transfer system design (load lock, robot hand, vacuum chuck, etc.) Equipment mainte...
I am ready to advance a new generation of multilayer ceramic capacitors, chip resistors, thermistors, and related parts, and I need a seasoned engineer who has driven the full cycle of electronic-component design, manufacturing, and process development. Your background in MLCC stack design, electrode patterning, sintering profile optimisation, and in-line quality control will be the core of this collaboration. Because many of our assemblies interface with semiconductor tools, practical knowledge of ceramic structural parts—ESCs, heaters, transfer arms, rings, discs, WDOs—is highly valued. If you have tuned shrinkage, matched CTEs, or solved plasma-etch erosion on these components, that insight will immediately inform our work. Experience formulating or adapting conducti...
I need a Fto based transparent compact patch antenna modelled in CST Studio Suite that can efficiently collect ambient RF power across a very wide band. The end use is pure RF energy harvesting, so instead of targeting a narrow communication band I am after the broadest practical frequency coverage you can squeeze out of a single‐layer or multilayer patch structure without driving size or complexity through the roof. Key requirements • Frequency coverage: “RF frequency wideband” – essentially as wide as we can get while keeping reasonable overall dimensions and good impedance matching. Please propose the exact limits you can reach and back them up with simulation data. • Polarisation: I am open to linear, circular or even dual; pick whichever help...
I need complete Gerber files for a multi-layer printed circuit board that will be built on six layers. The schematic is ready; what I’m missing is a clean, production-ready Gerber package that a board house can use without further tweaks. Here’s what I expect: • Layer stack-up defined and documented • Drill files, solder mask, paste mask, silkscreen, and assembly drawings included • All outputs checked against standard DRC rules and CAM verified before hand-off If you normally work in OrCAD, or similar professional tools, that’s perfect—just let me know which platform you prefer so I can provide compatible source files. Turnaround time and any questions about the stack-up or manufacturing constraints are open for discussion; I’m look...
I need complete Gerber files for a multi-layer printed circuit board that will be built on six layers. The schematic is ready; what I’m missing is a clean, production-ready Gerber package that a board house can use without further tweaks. Here’s what I expect: • Layer stack-up defined and documented • Drill files, solder mask, paste mask, silkscreen, and assembly drawings included • All outputs checked against standard DRC rules and CAM verified before hand-off If you normally work in OrCAD, or similar professional tools, that’s perfect—just let me know which platform you prefer so I can provide compatible source files. Turnaround time and any questions about the stack-up or manufacturing constraints are open for discussion; I’m look...
...enough to process or compress the image stream on-device. • Minimum 16 GB on-board storage for captured data. • Bluetooth for data sync, a vibrant TFT display for UI, magnetic snap-in battery charging, plus a USB port that lets me upload new firmware or diagnostic tools. Scope of work You will take the concept from architecture to board files: component selection, schematic capture, multilayer PCB layout, enclosure-aware routing, power management, and camera integration strategy. Please balance size, battery life, and heat dissipation while safeguarding signal integrity for the high-speed camera lines. Preferred toolchains are Altium Designer, KiCad, or Eagle—use whichever allows you to supply production-ready outputs. Deliverables (acceptance criteria)...
Multilayer saas platform for estate agents in uk We are looking to build a modern, scalable SaaS platform for estate agents focused on lead generation, automation, and campaign management (similar to Let’s Bid Property, but more advanced and user-friendly). Project Overview The platform will allow estate agents to identify high-quality property leads (sales prospecting, probate leads, off-market opportunities) and run automated outreach campaigns (primarily letters, with potential for email/SMS later). The goal is to create an all-in-one system that helps agents generate instructions through targeted, data-driven campaigns. --- Core Features Required 1. Lead Generation / Data Integration - Property data aggregation (Rightmove / Zoopla style sources or equivalents) - T...
...driver needs to be integrated cleanly so the stepper that moves the blood-film spreader glides without vibration or jerks. What I will hand over to you • Tested firmware ( ESP32-C3) • Current schematic, wiring diagram and BOM • Mechanical constraints for board outline and mounting points What I need back • Updated schematic reflecting any refinements you suggest • Space-efficient multilayer PCB layout with proper ground strategy, decoupling and short motor-phase traces • Gerber/ODB++, pick-and-place and drill files ready for fabrication • BOM with manufacturer part numbers and at least one readily available alternative per critical part • Brief design report highlighting noise-reduction choices, EMI counter-measures and ho...
I need a complete design for a compact consumer-electronics board that revolves around a PIC microcontroller. The scope spans three tightly-linked parts: • PCB hardware – Produce the schematic and multilayer layout in Altium Designer, include all libraries you create, and deliver the full manufacturing package (Gerbers, drill files, pick-and-place, and a PDF schematic). • MCU firmware – Write well-commented code in MikroBasic (or another PIC-friendly tool if you justify the switch). The firmware must read multiple sensors, exchange data through an efficient serial protocol, and use smart power-saving modes to stretch battery life. Please supply project files, compiled HEX, and a short flashing guide. • PC interface – Build a Windows utility in VB.NE...
...cost projections: • Revenue: model sales-volume forecasts that I’ll supply or refine with your guidance. • Costs: map every fixed expense—rent, salaries, insurance, utilities—so the break-even point is crystal-clear. Please build the model in Excel or Google Sheets with transparent, editable formulas. A simple break-even chart is welcome, but I’m not asking for a full sensitivity study or multilayer dashboard right now; precision in the numbers comes first. Deliverables 1. Fully functioning spreadsheet showing contribution margin, break-even units, and break-even revenue. 2. Brief explanatory note (1–2 pages) that walks through key assumptions and how to update them. The file should let me plug in new unit prices or cost figures and s...
...production-ready PCB that brings the health-sensing, BLE communication, and haptic feedback together in the smallest and most power-efficient form factor possible. Here’s what success looks like for this engagement: A complete schematic that ties together the chosen health-sensing components, low-energy wireless module for phone pairing, and a dedicated driver path for the haptic actuator. A multilayer PCB layout optimized for size, antenna performance, battery life, and ready for a standard SMT assembly line. Full manufacturing data (Gerbers/ODB++, pick-and-place, drill files), a clean BOM with active part numbers in supply, and the editable project file (Altium or KiCad preferred). Basic DFM and signal-integrity checks passed so the first prototype round goes smoothly. Sp...
This project covers the full end-to-end hardware development of a compact health-monitoring wearable. The core electronic system must seamlessly integrate three critical blocks—biosensors, power-management circuitry, and a wireless connectivity module—onto a multilayer PCB small enough for a wrist-worn form factor. Biosensing • The design centres on a heart-rate monitor as the primary biosensor. Signal quality, noise immunity, and optimal placement on the board and inside the enclosure all have to be engineered with production-ready accuracy. Power management • Fast-charge capability and ultra-low standby consumption are non-negotiable. Battery chemistry, protection ICs, and charging topology should be selected and simulated so that typical daily usage st...
...CAN-Bus and RS-485 for plant integration, plus a wireless link for cloud dashboards. A capable processor with dedicated RAM and non-volatile memory will run the firmware, manage data logging, generate a unique HWID at manufacture, and expose a Modbus-compatible register map to the HMI as well as secure MQTT to the cloud. Built-in self-diagnostics, battery-backed RTC, emergency-stop circuitry and multilayer protection (voltage, temperature, pressure) are mandatory to meet GMP, FDA and ISO expectations for validated environments. Deliverables I will review • Schematic, PCB layout and stack-up (Altium or KiCad) • Complete, production-ready BOM with lifecycle status • Gerber/ODB++ files plus assembly drawings • Firmware skeleton that proves sensor polling...
I need an experienced CAE specialist to help me finish my final-year mechanical engineering project: a fully detailed finite-element model of a small-caliber projectile striking a multilayer bullet-resistant vest. I have already defined the basic geometry and material stack-up in HyperMesh, and the plan is to solve everything with the explicit OpenRadioss solver. What I still require is expert guidance—and hands-on modelling work—so that the simulation reliably predicts: • penetration depth and overall armor performance, • the complete stress and strain fields inside the ceramic and composite layers (stress distribution, strain distribution), • projectile behaviour such as velocity reduction, deformation, and residual velocity, • correct energ...
I need a complete design for a compact consumer-electronics board that revolves around a PIC microcontroller. The scope spans three tightly-linked parts: • PCB hardware – Produce the schematic and multilayer layout in Altium Designer, include all libraries you create, and deliver the full manufacturing package (Gerbers, drill files, pick-and-place, and a PDF schematic). -PCBA implementation with JLCPCB Acceptance criteria – Board passes electrical rule checks and is ready for fabrication without edits. I will provide exact sensor part numbers, preferred connectors, and enclosure dimensions after kickoff; you are free to choose regulators, clocks, and protection components so long as you stay within a 3.3 V rail and keep the BOM cost-effective.
...capable of switching a single 230 V, 16–30 A line to 4, 8, or 12 outputs—without power loss—but none of them have reached the standards I expect. I have schematics, calculations, thermal measurements, and test logs: enough material to clarify every technical detail and speed up your work. I need a senior designer who can transform all this into a final solution, complete with ESP32 firmware, a multilayer PCB (4 or 6 layers, JLCPCB production - 3oz copper), and an accurate and documented simulation before production. Technical requirements to be met: • Maximum energy efficiency, component protection, and precision switching under load. • Integrated remote control, real-time monitoring, and an alarm system. • Proficiency with the ESP32 IDE for fir...
...auto-TDS control and an alkaline adjustment mode so users can fine-tune mineral content on demand. Sensor integration includes a TDS probe, temperature probe, flow sensor, and the drivers necessary for a mineral-mixing pump. All of this has to fit within a compact, appliance-friendly footprint and meet typical safety standards for domestic water equipment. Deliverables • Complete schematics and multilayer PCB layout (Gerber, drill, pick-and-place) • Well-structured BOM with part numbers available through major suppliers • Design files in Altium, KiCad or equivalent, plus exported manufacturing packages • Reference design for Wi-Fi module antenna placement and touch-button stack-up • Test points and firmware pinout documentation so my firmware...
...capable of switching a single 230 V, 16–30 A line to 4, 8, or 12 outputs—without power loss—but none of them have reached the standards I expect. I have schematics, calculations, thermal measurements, and test logs: enough material to clarify every technical detail and speed up your work. I need a senior designer who can transform all this into a final solution, complete with ESP32 firmware, a multilayer PCB (4 or 6 layers, JLCPCB production - 3oz copper), and an accurate and documented simulation before production. Technical requirements to be met: • Maximum energy efficiency, component protection, and precision switching under load. • Integrated remote control, real-time monitoring, and an alarm system. • Proficiency with the ESP32 IDE for fir...
Up! I can deliver a complete end-to-end solution covering PCB design, PIC firmware, and a Windows VB.NET interface for your compact electronics board. I have experience designing multilayer boards in Altium, developing efficient microcontroller firmware with low-power optimization, and building reliable PC tools for device configuration and data logging. You’ll receive a fabrication-ready hardware package, well-structured firmware with compiled HEX and flashing guide, and a user-friendly desktop utility that communicates over USB, streams live sensor data, and logs to CSV. I focus on clean design, power efficiency, and dependable communication between hardware and software. Ready to start as soon as you share the sensor list and mechanical constraints
Hello , I need a complete design for a compact consumer-electronics board that revolves around a PIC microcontroller. The scope spans three tightly-linked parts: • PCB hardware – Produce the schematic and multilayer layout in Altium Designer, include all libraries you create, and deliver the full manufacturing package (Gerbers, drill files, pick-and-place, and a PDF schematic). • MCU firmware – Write well-commented code in MikroBasic (or another PIC-friendly tool if you justify the switch). The firmware must read multiple sensors, exchange data through an efficient serial protocol, and use smart power-saving modes to stretch battery life. Please supply project files, compiled HEX, and a short flashing guide. • PC interface – Build a Windows utility...
