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Title: KiCad 4-to-6 Layer PCB Design (Multi-RF: UWB, LoRa, Satellite, NFC, Wireless Charging) Job Type: Fixed Price / Milestone-Based Budget: $1,000 – $2,500 (Design & Manufacturing File Delivery Only) ________________________________________ Project Overview Looking for an expert Hardware & RF Layout Engineer to design a single, ultra-low-power, multi-radio handheld communication device. The entire project must be designed natively in KiCad (v7 or v8). The final deliverables must include complete native KiCad source files and automated SMT production exports. All primary ICs, modules, and antennas have already been finalized and sourced from Mouser. No high-speed DDR memory routing or complex Linux HDI microvias are required for this project. The design uses an all-microcontroller architecture. ________________________________________ Core Components & Subsystems to Integrate Your design will tie the following components into a unified, functional schematic and layout: 1. Host MCU (The Brain): o STM32L4S7VIT6 (Ultra-low-power Arm Cortex-M4 MCU, 120 MHz, 2MB Flash, LQFP-100 package). Will act as the primary SPI/UART/I2C host controller. 2. NFC / Proximity Subsystem: o PN7462AUHN/C300Y (Dedicated NFC Cortex-M0 MCU). Interfaces with the main STM32 via UART/SPI and routes directly to a Molex 146236-0131 flexible NFC antenna with a 13.56 MHz tuning/matching network. 3. Terrestrial Mesh Radio: o Semtech SX1262-based LR62E module (+22.6 dBm Sub-GHz LoRa module). Interfaces via SPI; requires clean layout to its onboard [login to view URL] connector. 4. Local Precision Ranging Engine (UWB): o Qorvo QM35825TR13 SoC (74-BGA package). Must be configured to route to dual AVX/Kyocera 9001978 ultra-small UWB chip antennas. This requires precise differential microwave layout engineering (3.5 GHz to 9 GHz range) following Qorvo's hardware design guidelines. 5. Global Satellite Messaging: o Swarm M138 Transceiver Breakout (SPX-20107). Interfaces via simple logic-level UART. 6. Low-Power Display: o Adafruit 4778 (FeatherWing 2.9" Tri-Color ePaper Display using the SSD1680 driver over SPI). 7. Sensors: o ADXL366BCCZ / ADXL362BCCZ (Nanopower SPI Accelerometers for motion wake-up triggers). o MAX30205MTA+ (I2C human body temperature sensor, requiring careful thermal isolation from heat-generating components). 8. Power & Wireless Charging Infrastructure: o BQ51013BRHLT Qi Wireless Power Receiver IC paired with a Vishay IWAS3827 receiver coil. o BQ24040DSQT 800mA Linear Li-Ion Battery Charger to safely manage a 3.7V 2000mAh Li-Polymer battery. o TPS62170QDSGTQ1 Buck Regulator for high-efficiency system-wide step-down power distribution. ________________________________________ Technical & Layout Constraints • EDA Tool: 100% native KiCad. No converted Altium files accepted. • Layer Count: 4-layer minimum, 6-layer maximum using standard mechanical through-vias (no blind/buried microvias to keep fabrication cheap). • RF Optimization: 50-ohm coplanar waveguide or microstrip trace impedance matching is required for all active antenna paths (UWB, LoRa, Satellite, NFC). • Thermal Isolation: The MAX30205 temperature sensor must be micro-routed on an isolated "island" cut away from the main power management components to prevent internal board heat from skewing environmental readings. • DFM (Design for Manufacturing): The layout must use standard design rules compatible with low-cost rapid assembly plants (e.g., JLCPCB or PCBWay constraints). The BGA footprint for the Qorvo UWB chip must be optimized for standard automated SMT assembly reflow. ________________________________________ Required Freelancer Qualifications • Proven track record designing multi-RF boards, specifically with Gigahertz-range wireless layout (UWB / Microwave). • Experience with ultra-low-power STM32 microcontroller routing, decoupling capacitor placement, and power plane optimization. • Deep proficiency with KiCad schematic capture, footprint creation, and PCB layout editors. • High-quality portfolio examples of previously completed 4+ layer physical PCBs. ________________________________________ Milestones & Deliverables • Milestone 1 (25% Budget): Schematic design capture and complete pin-out mapping verification between host MCU and peripheral ICs. Delivery of initial .kicad_sch file. • Milestone 2 (25% Budget): Preliminary 2D/3D component placement review and stack-up definition inside the KiCad PCB editor. • Milestone 3 (30% Budget): Final 100% completed trace routing, impedance calculations, and 0-error Design Rule Checking (DRC). • Milestone 4 (20% Budget): Final Delivery Package. Full source project files (.kicad_pro, .kicad_sch, .kicad_pcb), Schematic PDFs, fabrication-ready Gerber files (formatted for easy JLCPCB/PCBWay upload), NC Drill files, automated placement Centroid/CPL/Pick-and-Place files, and a manufacturing-ready Bill of Materials (BOM) with verified supplier footprints. ________________________________________
Project ID: 40613832
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34 freelancers are bidding on average $1,328 USD for this job

With a comprehensive background in electrical engineering and a holistic understanding of embedded systems, I possess the skills that make me an excellent fit for your multi-RF device project. My experience with STM32 microcontroller routing, decoupling capacitor placement, and power plane optimization, dovetails precisely with the STM32L4S7VIT6 Host MCU you intend to use. Drawing from work on projects like 3-phase induction motor vector control drives and DSP implementation on motor drives, I have honed my abilities to deliver cost-effective hardware solutions without compromising performance. Aside from technical knowledge, proficiency with KiCad and its editors would save crucial time spent transitioning from one platform to another. I understand the importance of adhering to design for manufacturing(DFM) principles while creating prototypes; therefore, my designs are compatible with JLCPCB or PCBWay constraints used by rapid assembly plants ensuring they can be easily manufactured at low costs without compromising on quality. Drawing from my portfolio evidence showcases of these successful strategies on numerous projects. For a winning combination of prior experience in multi-RF board design (including Gigahertz-range wireless layout),a deep understanding of KiCad schematic capture & PCB layout editors, and a commitment to delivering high-quality work within budget, I am confident the project could not be better placed than in my hands.
$1,250 USD in 20 days
7.4
7.4

As an experienced Electrical/Electronics Engineer and Professional PCB Designer with a notable history working with Altium, Eagle, KiCAD, and EasyEDA, I am well-qualified to design an ultra-low-power RF device using native KiCad for your esteemed project. My decade-long track record in this industry speaks volumes about my ability to handle complex tasks involved in developing multi-RF boards – exactly what your project demands. Moreover, having expertise with Gigahertz-range wireless layout such as UWB and Microwave amplifies my suitability for this task. My forte in routing decoupling capacitors, power plane optimization alongside layouts compatible with low-cost rapid assembly plants puts me at the top among potential candidates. I have successfully designed circuits similar to your requirement involving advanced components such as STM32 microcontrollers like the one specified. Lastly, being ranked in the top 1% of skilled professionals and serving as a Preferred Freelancer not only gives me credibility but also speaks to my unwavering commitment to delivering high-quality work on time. I understand that you're looking for someone who can translate your ideas into reality while adhering to specific budgetary constraints. And that's precisely what I promise: to bring together the world of RF communication you have envisioned into a singular, flawless design within-budget and 100% aligned with your needs
$1,125 USD in 7 days
6.9
6.9

Hi there, I read your offer carefully and understand that you need a native KiCad 7/8 multi-radio handheld PCB integrating STM32L4, PN7462 NFC, SX1262 LoRa, Qorvo UWB, Swarm satellite UART, ePaper display, sensors, Qi wireless charging, Li-ion charging, and low-power regulation. I can support the schematic capture, pin mapping, RF-aware placement, 4–6 layer stack-up planning, 50-ohm antenna routing, UWB/LoRa/NFC/satellite layout precautions, MAX30205 thermal isolation, DFM checks, Gerbers, BOM, CPL, and full KiCad manufacturing package. My background in embedded systems, RF-aware PCB layout, STM32 hardware, low-power devices, sensor integration, wireless modules, power management, and production-ready KiCad/Altium documentation fits this project well. Just send me a message and we can review the sourced parts, antenna guidelines, and milestone schedule. Best regards, Samuel Tshibangu
$1,250 USD in 1 day
6.4
6.4

Your project matches my expertise in KiCad, STM32, and multi-layer embedded PCB design. I have experience with RF layouts, low-power systems, impedance-controlled routing, and preparing production-ready files for JLCPCB and PCBWay. I can deliver the complete KiCad project, including schematics, 4–6 layer PCB, DRC-clean layout, Gerbers, BOM, CPL, and manufacturing documentation while following your milestone-based workflow. Before starting, I would like to confirm the preferred PCB stack-up, target impedance values, and whether Qorvo’s UWB layout guidelines and reference design files will be provided.
$1,125 USD in 7 days
6.8
6.8

Hi, I have 10+ years of experience in embedded hardware, RF PCB design, and firmware development, with 25+ custom multilayer PCB projects and 20+ four-layer production boards delivered using KiCad and Altium. I have designed low-power STM32 systems, RF interfaces, power management, and impedance-controlled layouts, including BLE, LoRa, Wi-Fi, and GNSS products, while improving signal integrity and reducing EMI issues in production hardware. Approach ✅ I will capture the complete KiCad schematic, verify every interface, power domain, and pin mapping, then review the architecture before PCB layout. ✅ I will define a 4-6 layer stack-up, optimize RF partitioning, controlled-impedance routing, grounding, shielding, and thermal isolation for the MAX30205 sensor. ✅ I will complete routing with DFM-compliant rules, optimize BGA fan-out, validate DRC/ERC, and generate manufacturing-ready Gerber, BOM, CPL, and assembly files. Questions ✅ I would like to confirm whether Qorvo provides the complete QM35825 reference layout, stack-up, and impedance requirements for the dual UWB antennas. ✅ Will the Swarm M138 breakout remain as a module on the PCB, or should it be redesigned as a native circuit? ✅ Do you already have a mechanical enclosure with fixed PCB dimensions, antenna locations, and keep-out zones for RF optimization? Best, Yaroslav
$1,125 USD in 7 days
5.1
5.1

⭐⭐⭐⭐⭐ Your project aligns well with my background in mixed-signal, low-power, and RF PCB design using KiCad. I have extensive experience developing 4- to 6-layer boards integrating STM32 MCUs, LoRa, NFC, wireless power, sensors, and high-speed RF sections while maintaining DFM compliance for JLCPCB and PCBWay. For this design, I'll begin with complete schematic capture and interface verification, followed by stack-up planning, power integrity, RF partitioning, controlled-impedance routing, and thermal optimization. Special attention will be given to the UWB RF layout, 50Ω transmission lines, antenna keep-out areas, ground stitching, decoupling strategy, and isolation of the MAX30205 sensor from heat sources. The final design will pass ERC/DRC and include impedance-controlled routing suitable for standard fabrication without blind or buried vias. Deliverables include native KiCad project files, schematics, PCB layout, Gerbers, NC Drill, Pick-and-Place, BOM with verified manufacturer part numbers, 3D models, and complete manufacturing documentation. I can follow your milestone schedule, provide regular design reviews, and start immediately. I would be glad to discuss the RF stack-up, impedance targets, and manufacturing assumptions before beginning to ensure a smooth path from schematic to production-ready files.
$1,000 USD in 6 days
4.9
4.9

With the technical complexity and RF optimization needs of your project, choosing me, Julian Mendez, would be a valuable investment. Over my 8-year career, I've developed a robust proficiency in multi-RF board design - including Gigahertz-range wireless layout involving UWB/Microwave technologies. My skill set is a perfect match for your requirements. KiCad is my native territory. I'm well-versed in all aspects of its usage: schematic capture, footprint creation and PCB layout editing. Furthermore, I have a proven track record of ensuring DFM compatibility with low-cost rapid assembly plants like JLCPCB or PCBWay, which I will bring to bear to guarantee the delivery of your desired results. Temporal accuracy is just as important: I am confident in delivering promptly through any pressure. As a Senior Electronics Engineer with a deep understanding of circuit design and an innovative approach to problem-solving, I have consistently delivered hardware solutions that are efficient, reliable and compliant with safety standards; qualities you prioritize too. My experience goes beyond design itself to encompass firmware development, system integration and project management. Thus, not only will you get high-quality guaranteed hardware but also effective support throughout the process.
$1,125 USD in 14 days
4.4
4.4

Hi I am an embedded systems engineer with over 16 years of experience. I have extensive experience designing multilayer, ultra-low-power MCU products with mixed RF, precision sensors, battery charging, and production-ready KiCad deliverables. I can take this design through the four proposed milestones: verified schematic and pin mapping, placement and stack-up review, controlled-impedance routing with clean power/ground architecture, and a complete manufacturing package. Particular attention will be given to the QM35825 UWB paths and antenna clearances, NFC matching network, RF isolation, BGA escape strategy using standard through-via fabrication, and the thermally isolated MAX30205 island. I will also review component availability, footprints, decoupling, power sequencing, and assembly constraints before final release. My background includes full consumer-grade product development from concept through prototype and production, so I can also support board bring-up and firmware integration if needed. Relevant client PCB designs cannot be shared publicly, but suitable examples can be shown privately. Please share the target board dimensions/enclosure constraints, preferred fabricator and stack-up, and available Qorvo reference material. Please contact me to discuss details.
$1,500 USD in 35 days
4.6
4.6

Hello, Your project is an interesting combination of low-power embedded design and multi-radio PCB integration. I have extensive experience designing STM32-based hardware, multilayer PCBs, RF layouts, power management, and manufacturing-ready designs. While KiCad is your required platform, my focus is always on delivering a board that is reliable in production, not just one that passes DRC. I pay close attention to RF isolation, controlled-impedance routing, power integrity, decoupling, thermal management, and DFM to ensure successful assembly at JLCPCB or PCBWay. For complex RF sections such as UWB, I follow vendor layout recommendations closely and verify critical routing before finalizing the design. I communicate progress through milestone reviews and provide complete native KiCad source files and manufacturing outputs. I would be pleased to discuss your architecture and help bring this product to production. Best regards, ShengLin Gu.
$1,000 USD in 7 days
3.5
3.5

Hello, I would be excited to assist with your Multi-RF Device design using KiCad. I have experience designing complex PCB layouts that integrate multiple RF modules while maintaining signal integrity, minimizing interference, and optimizing overall performance. My focus is on creating reliable, manufacturable designs that meet both electrical and mechanical requirements. For this project, I can develop the schematic, PCB layout, RF component placement, controlled impedance routing, grounding strategy, and design-for-manufacturing considerations using KiCad. I pay close attention to RF best practices, including isolation, shielding, decoupling, and trace optimization, ensuring the final design performs efficiently and is ready for fabrication and testing. I am committed to delivering high-quality work, maintaining clear communication throughout the project, and meeting agreed deadlines. I look forward to discussing your specifications, frequency bands, and design goals so we can build a robust multi-RF solution that meets your performance expectations.
$750 USD in 7 days
3.4
3.4

Hello, If you’re seeking a hardware architecture expert for complex multi-radio boards, I am confident I’m the ideal fit for your project. I have recently completed a 6-layer UWB + LoRa STM32-based handheld for industrial tracking, so your scope aligns perfectly with my experience. I fully understand the importance of precise RF layout, robust power management, and expert integration of multiple wireless subsystems—all natively within KiCad. Your focus on DFM, production-ready outputs, and tightly controlled impedance for UWB and LoRa paths is exactly where my expertise shines. I have over 15 years of experience in advanced embedded systems, multi-layer RF PCB layout, and ultra-low-power architecture design. My portfolio includes several designs utilizing STM32 MCUs, Qorvo UWB chips, and production-tested layouts for rapid JLCPCB/PCBWay assembly. * Expert schematic capture and pinout verification for all MCU and RF subsystems, ensuring seamless interconnection from day one * Professional 4-6 layer KiCad PCB stackup, with careful power/ground plane planning and 3D placement for optimal RF performance * Precise impedance-controlled RF trace routing, including BGA fanout for Qorvo UWB, NFC, and LoRa, with thorough DRC and manufacturability checks * Delivery of full native KiCad project files, verified Gerbers, and a complete manufacturing package for smooth, error-free production handoff Let’s discuss how I can help bring your multi-RF device to life with world-class reliability and industry-standard deliverables. Please contact me. Thanks, Robert
$750 USD in 2 days
0.0
0.0

I understand you need an expert Hardware & RF Layout Engineer to design a single, ultra-low-power, multi-radio handheld communication device, specifically handling UWB, LoRa, Satellite, NFC, and Wireless Charging, all natively in KiCad v7 or v8. I recently completed a similar multi-radio PCB for a wearable device, achieving optimal signal integrity across multiple frequency bands within tight constraints. My approach involves meticulously placing and routing all primary ICs and modules in KiCad, prioritizing RF performance with precise impedance control and minimizing trace lengths for UWB and Satellite. I will create detailed layer stackups, including dedicated ground planes and optimized signal routing for LoRa and NFC. The final deliverables will be the complete, native KiCad project files and fully automated SMT production exports (Gerbers, drill files, BOM, placement data). What are the target impedance values for the UWB and Satellite RF traces? Ready to start as soon as you confirm scope.
$1,351 USD in 21 days
0.0
0.0

Here’s a polished bid tailored to the multi-RF KiCad PCB project: ⭐⭐⭐Hello, How are you?⭐⭐⭐ I understand you need a fully native KiCad 4-to-6-layer PCB design integrating STM32, NFC, LoRa, UWB, satellite messaging, ePaper, sensors, LiPo charging, and Qi wireless power into a manufacturable low-power handheld platform. I have strong experience with multilayer RF PCB design, STM32 hardware, BGA fan-out, controlled-impedance routing, antenna matching networks, low-power architecture, and KiCad production workflows. I can complete the project in clearly defined milestones and deliver a fabrication-ready package within your stated budget range. What I’ll Deliver: * Native KiCad Design * RF-Controlled Layout * Manufacturing Package What I Need to Start: * Datasheets & Reference Designs * Mechanical Constraints * Final Pin Assignments I will first verify all interfaces, power domains, voltage levels, antenna paths, and MCU pin mapping before completing the schematic. The layout will include an appropriate 4- or 6-layer stack-up, continuous RF reference planes, calculated 50-ohm transmission lines, careful UWB differential routing, isolated analog and temperature-sensor areas, optimized decoupling, and practical BGA escape routing using standard through-vias. I can provide portfolio examples of previous multilayer RF, STM32, BGA, UWB, LoRa, wireless charging, and KiCad-based PCB projects for review. Please send me a message and let's discuss in detail. Sincerely, Ian
$1,000 USD in 7 days
0.0
0.0

Thanks for detail. I have experience in multi layer PCB design, STM32 based embedded systems, RF aware layouts. I can make you get advanced result quickly. Thanks Jefry
$1,100 USD in 10 days
0.0
0.0

Hello, I am an experienced Hardware & RF PCB Design Engineer with 10+ years of experience in STM32, LoRa, NFC, wireless devices, and multi-layer PCB design. I can design this project in native KiCad v7/v8 and provide complete production-ready files including schematic, PCB layout, Gerbers, BOM, Pick & Place, and source files. My experience includes: • STM32 low-power MCU designs • LoRa/RF antenna routing and 50Ω impedance control • NFC circuits and antenna integration • Battery charging and power management circuits • Manufacturing-ready PCB preparation I will focus on clean RF separation, optimized component placement, power integrity, thermal isolation, and DRC-clean layout following manufacturer guidelines. I can deliver a complete KiCad project ready for PCB manufacturing. I would like to discuss your board size, enclosure constraints, and antenna placement requirements before starting. Best regards, Maksym
$1,100 USD in 7 days
0.0
0.0

Your project requires a strong combination of RF PCB design, power electronics, and low-power embedded hardware, and I'd be excited to help develop a production-ready KiCad design. I have experience designing multi-layer KiCad PCBs, integrating STM32-based systems, RF modules, wireless power, battery management, and manufacturing-ready layouts optimized for JLCPCB and PCBWay. My approach Develop the complete schematic in native KiCad v8 with verified pin mapping and design review. Optimize component placement to minimize RF interference while isolating sensitive analog and temperature-sensing circuitry. Route controlled-impedance RF traces for the UWB, LoRa, NFC, and satellite interfaces following manufacturer reference guidelines. Build dedicated power planes, proper grounding strategy, decoupling networks, and thermal management. Perform full ERC/DRC verification before release. Deliver fabrication-ready manufacturing files compatible with JLCPCB and PCBWay. Deliverables Native KiCad project (.kicad_pro, .kicad_sch, .kicad_pcb) Schematic PDFs Gerber and NC Drill files Pick-and-Place (CPL/Centroid) files Manufacturing BOM with verified footprints Layer stack-up documentation Assembly notes and design documentation Revision support throughout each milestone Best regards, Sidra
$1,500 USD in 8 days
0.0
0.0

As an electrical engineer with significant experience in the realm of embedded systems and electronics, my expertise aligns perfectly with your project's objectives. Having solved numerous design challenges across various industries - from robotics to industrial automation and power electronics - I possess a deeply rooted understanding of what it takes to build efficient, high-performance solutions. I have a comprehensive background in all aspects relevant to your undertaking: schematic design, PCB layouting, and embedded firmware specifically with the STM32 microcontroller family you've chosen for your project. My knowledge stretches beyond design into DFx aspects such as Design for Manufacturing (DFM) and Design for Assembly (DFA) both essential components of your project. In addition to my extensive experience with RF systems - especially multi-RF boards - which is directly applicable to your multi-radio communication device, I boast in-depth proficiency with KiCad. From schematic capture and footprint creation to critical PCB layout optimization, my skillset guarantees precise implementation and coherent integration on your KiCad platform.
$1,000 USD in 7 days
0.0
0.0

Hello. I am interested in your multi-RF handheld communication device PCB design project. I have experience designing embedded hardware and multi-layer PCBs using KiCad, including MCU-based systems, power management circuits, communication interfaces (SPI, UART, I2C, CAN, RS485), and RF-related layouts. I understand the importance of controlled impedance routing, antenna matching, power integrity, thermal isolation, and DFM requirements for manufacturing. For this project, I can help with: Native KiCad schematic and PCB layout (v7/v8) 4–6 layer PCB design with standard through vias STM32L4 MCU routing and power optimization RF layout considerations for LoRa, UWB, NFC, and satellite modules 50Ω controlled impedance routing and antenna interface design DRC verification and manufacturing package preparation for JLCPCB/PCBWay I will provide complete KiCad source files, Gerber files, drill files, Pick & Place data, and BOM as required. Your project is technically challenging but well specified, and I believe my hardware design experience matches your requirements. I would be happy to discuss the details and start with the first milestone. Best regards,
$750 USD in 7 days
0.0
0.0

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